Research advances in nano-composite solders

Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging

Nano-conductive Adhesives for Nano-electronics Interconnection

With the phasing out of lead-bearing solders, electrically conductive adhesives (ECAs) have been identified as one of the environmentally friendly alternatives to tin/lead (Sn/Pb) solders in electronics packaging applications. In particular, with the requirements for fine-pitch and high-performance interconnects in advanced packaging, nanoconductive adhesives are becoming more and more importan...

Using Nanoparticles and Carbon Nanotubes to Enhance the Properties of a Lead-free Solder

In the present study, using the powder metallurgy route, varying amount of nano-sized Y2O3 particulates and Nicoated carbon nanotubes (Ni-CNTs) were intentionally incorporated into the Sn-3.5Ag-0.7Cu solder to develop two nanocomposite solder systems. The samples were extruded and characterized in terms of their wettability, thermal, microstructural and tensile properties. Characterization resu...

A Nano Silver Replacement for High Lead Solders in Semiconductor Junctions

While it is now widely accepted that most electronic assembly can be reliably effected with lead-free solders, a practicable alternative to the high-lead high-melting-point solders has not been available. That reality has been acknowledged by the interim exemption from the requirements of the EU RoHS Directive granted for solders with 85% or more of lead. With no direct replacement yet found by...

Effect of Ag Nanopowders on Microstructure, Hardness and Elastic Modulus of Sn-bi Solders

Article history: Received: 14.3.2013. Received in revised form: 23.12.2013. Accepted: 23.12.2013. This paper presents the microstructure, hardness and elastic modulus of Sn58Bi, Sn57Bi1Ag and Ag nanopowders reinforced Sn58Bi composite solders. Microstructural observations reveal that the Ag nanopowders reinforced Sn58Bi composite solders have smaller grains of Ag3Sn and a more uniform Ag3Sn dis...